i ntegrated c ircuits d ivision www.ixysic.com ds-LCB111-r09 1 LCB111 single pole, normally closed optomos ? relay e 3 pb part # description LCB111 6-pin dip (50/tube) LCB111s 6-pin surface mount (50/tube) LCB111str 6-pin surface mount (1000/reel) parameter rating units load voltage 350 v p load current 120 ma rms / ma dc input control current 2 ma on-resistance (max) 35 ? applications features description approvals ordering information pin configuration switching characteristics of normally closed devices ? telecommunications ? telecom switching ? tip/ring circuits ? modem switching (laptop, notebook, pocket size) ? hook switch ? dial pulsing ? ground start ? ringing injection ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment?patient/equipment isolation ? security ? aerospace ? industrial controls ? ul recognized component: file e76270 ? csa certified component: certificate 1175739 ? en/iec 60950-1 certified component: tuv certificate b 09 07 49410 004 ? low input control current: 2ma ? 3750v rms input/output isolation ? low drive power requirements (ttl/cmos compatible) ? high reliability ? arc-free with no snubbing circuits ? fcc compatible ? vde compatible ? no emi/rfi generation ? small 6-pin package ? machine insertable, wave solderable ? tape & reel, surface mount version available form-b i f 10% 90% i load t on t off 1 3 2 4 5 6 + control C control do not use load do not use load ac/dc configuration 1 3 2 4 5 6 + control C control do not use + load C load dc only configuration LCB111 is a 350v, 120ma, 35 ? , normally closed (1-form-b) solid state relay featuring high sensitivity. it uses optically coupled relay technology to provide a 3750v rms isolation barrier between the input and the output of the relay. its optically coupled outputs, which use the patented optomos architecture, are controlled by a highly efficient gaaias infrared led. the LCB111 can be used to replace mechanical relays, and offers the superior reliability associated with semiconductor devices. because it has no moving parts, it can offer faster, bounce-free switching in a more compact surface mount or thru-hole package.
i ntegrated c ircuits d ivision www.ixysic.com 2 r09 LCB111 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. parameter conditions symbol min typ max units output characteristics load current ac/dc configuration, continuous - i l - - 120 ma rms / ma dc dc configuration, continuous - - - 200 ma dc peak 10ms i lpk - - 350 ma p on-resistance i l =120ma - 23 35 ac/dc configuration r on ? dc configuration i l =200ma - 7 10 off-state leakage current v l =350v p i leak --1 ? a switching speeds turn-on t on -25 i f =2ma, v l =10v ms turn-off t off -25 output capacitance v l =50v, f=1mhz c out -25- pf input characteristics input control current to activate i l =120ma i f -12 ma input control current to deactivate - i f 0.4 0.7 - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 ? a common characteristics capacitance, input to output - c i/o -3- pf parameter ratings units blocking voltage 350 v p reverse input voltage 5 v input control current peak (10ms) 50 ma 1a input power dissipation 1 150 mw total power dissipation 2 800 mw isolation voltage, input to output 3750 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / oc 2 derate linearly 6.67 mw / oc absolute maximum ratings @ 25oc electrical characteristics @ 25oc
i ntegrated c ircuits d ivision LCB111 www.ixysic.com 3 r09 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating LCB111 / LCB111s msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time LCB111 / LCB111s 250oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb
i ntegrated c ircuits d ivision www.ixysic.com 4 r09 LCB111 mechanical dimensions dimensions mm (inches) pcb hole pattern 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 5.080 0.127 (0.200 0.005) 6 - 0.800 dia. (6 - 0.031 dia.) 0.254 0.0127 (0.010 0.0005) 9.144 0.508 (0.360 0.020) 7.239 typ (0.285 typ) 7.620 0.254 (0.300 0.010) 3.302 0.051 (0.130 0.002) 4.064 typ (0.160 typ) 0.457 0.076 (0.018 0.003) 8.382 0.381 (0.330 0.015) 2.54 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 1.651 0.254 (0.065 0.010) pin 1 dimensions mm (inches) pcb land pattern 0.254 0.0127 (0.010 0.0005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 3.302 0.051 (0.130 0.002) 4.445 0.254 (0.175 0.010) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 8.382 0.381 (0.330 0.015) 2.54 0.127 (0.100 0.005) 9.524 0.508 (0.375 0.020) 6.350 0.127 (0.250 0.005) 0.457 0.076 (0.018 0.003) 1.651 0.254 (0.065 0.010) 1.651 0.254 (0.065 0.010) pin 1 LCB111 LCB111s
i ntegrated c ircuits d ivision specification: ds-LCB111-r09 ?copyright 2012, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 12/22/2012 for additional information please visit our website at: www.ixysic.com 5 LCB111 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. notes: 1. all dimensions carry tolerances of eia standard 481-2 2. the tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 dimensions mm (inches) embossment embossed carrier 330.2 dia (13.00 dia) top cover tape thickness 0.102 max (0.004 max) w=16.00 (0.63) b 0 = 10.10 (0.398) a 0 = 10.10 (0.398) p = 12.00 (0.472) k 1 = 3.80 (0.15) k 0 = 4.90 (0.19) user direction of feed LCB111str tape & reel
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